I le 2021, o loʻo ogaoga pea le faʻamaʻi fou o le pale, ma ua matua faʻatapulaʻaina le tamaoaiga o le lalolagi.Ae ui i lea, e le mafai e le crown virus ona taofia le saoasaoa o le alualu i luma faasaienisi ma tekinolosi.O mea tau militeri o tekinolosi sili ona faʻavae ma faʻamutaina.I lalo o le malosi o le atinaʻeina o manaʻoga o mea e sui ai meafaigaluega, o le tulaga mataʻutia faatekinolosi faʻapolopolo e mataʻina pea.I le tolu tausaga ua tuanaʻi, ua faʻasolosolo ona matou faʻalauiloaina le "Major Development Trends of Foreign Military Materials Technology".E ala i le faʻavasegaina faʻapitoa o le alualu i luma faatekinolosi i le fanua o mea a le militeri i lenei tausaga, ua matou filifilia tekinolosi e sefulu ma le taua tele, ma faʻamasinoina le tulaga o le atinaʻe i le lumanaʻi o meafaitino, faʻaosofia le au faitau ma le au faitau.Tagata suʻesuʻe faʻasaienisi, saunia se faʻavae mo talanoaga.I le tolu tausaga talu ai, na ausia ai e lenei galuega ni tali lelei.
I le 2021, o le a malosi le atinaʻeina o mea faʻapipiʻi, ma o le a latou faʻatinoina lelei i le suʻesuʻeina o talosaga i fanua o le vateatea ma auupega;mo siosiomaga faʻaoga eseese, o mea fou e pei o le maualuga o le faʻaogaina o le radiation ma le ofuina o le a faʻaalia;2nm process chips o le a faʻamalamalamaina mea tau eletise.I le tulaga maualuga o le atinaʻeina o faʻamatalaga faʻaoga mea faigaluega, o mea bismuth ua tatalaina le auala mo le 1nm process chips.E le gata i lea, o le faʻaofiina o algorithms fou ua faʻavaveina ai foi le mauaina o mea faʻapitoa eseese ma mea faʻapipiʻi maualuga-entropy e faʻalagolago i le mamanu vaega.
I le aso 19 o Ianuari, 2022, na faʻatulagaina ai e le China Aviation Industry Development Research Center tagata atamamai i Beijing e faʻatino le galuega filifilia o "Major Trends in Foreign Military Materials in 2021".Mai le aofaʻi o 158 atinaʻe agaʻi i totonu o fanua e lima, e aofia ai mea uʻamea faʻatinoga, mea faʻapipiʻi faʻapitoa, mea faʻapitoa faʻapitoa, faʻamatalaga faʻaeletoroni mea faʻaogaina, ma mea faʻapitoa autu, o faiga faʻapitoa e sefulu o loʻo mulimuli mai ua filifilia mo faʻamatalaga e faʻalapotopotoga fai filifiliga, iunite su'esu'e faasaienisi ma le au faitau.
Na fa'amaonia lelei e le US Air Force le fa'aauauina o le fiber 3D printer wing spars
O le gaosiga vave ma le taugofieina o le faʻaogaina o mea e manaʻomia mo le atinaʻeina o mea faʻapipiʻi fiber carbon.O le US Air Force Research Laboratory o loʻo taulaʻi tele i le faʻaauauina o le fiber 3D lomitusi tekonolosi, ma le faʻamoemoe e mafai ona avea ma auala faʻatekonolosi faʻapitoa e sui ai auala faʻapipiʻi tuʻufaʻatasia masani, faʻaitiitia le tau ma le taʻitaʻi taimi o vaega tuʻufaʻatasia.Ia Aperila 2021, na fa'aogaina ai e le US Continuous Composite ana pateni fa'aauau le pateni fa'alava 3D lomitusi tekonolosi (CF3D) e lolomi manuia ai le 2.4-mita-umi, 1.8-kilogram carbon fiber composite spar assemblies, fa'amae'aina le US Air Force Research Laboratory.
Lua-tausaga Wing Structure Design for Manufacturing (WiSDM) konekarate.Fa'ai'uga fa'ata'ita'iga o le fa'apotopotoga mulimuli apa'au, o le apa'au fa'apipi'i atoa na utaina i le 160% o le uta fa'atapula'a o mamanu.E leai se fua po'o se fa'aleagaina va'aia o le CF3D lolomi fa'ailoga na iloa.O le lolomi afi kaponi spar na ausia se vaega o le alava voluma vaega o le 60% ma e tusa ma le 1% -2% gaogao.
O lenei faiga fou tu'ufa'atasiga o lo'o fa'aalia ai le impregnation in-situ, fa'amaopoopo ma fa'amālōlōina, lea e fa'aitiitia ai tau ma taimi ta'imua.O le faiga fa'aautomate atoa o lo'o fa'aalia ai le tipiina ma le toe fa'afo'iina mo le pa'u o le pa'u ma le mafiafia o vaega eseese i totonu o le fausaga.O le poloketi, lea e fa'amalieina ai filo fa'atulagaina, o se tala manuia i le fa'aogaina o se fa'ata'ita'iga CF3D material solution, fa'atasi ai ma a'afiaga mo le gaosiga o vaega taugatā o le aerospace.
Taimi meli: Iul-05-2022